EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.
April 15, 2016 – Abstracts due
June 1, 2016 – Notification of acceptance
July 1, 2016 – Final materials due
The EDI CON technical program focuses on a range of high frequency and high speed electronic design issues ranging from modeling and design to component characterization, system integration, and verification. It includes:
The EDI CON technical sessions offer insights on today’s design challenges using available electronic design tools and techniques. Divided into technical tracks, each session is based on peer-reviewed abstracts and papers that have been selected by the EDI CON Technical Advisory Committee. The technical program also includes workshops and panel sessions that offer interactive opportunities to explore the technologies and methodologies that are critical to success in today’s electronic designs.
Invited keynote speakers include industry executives, industry experts, and leading researchers. Technical sessions topics include RF and microwave design, high-speed digital design, measurement and modeling, EMC/EMI, system-level measurements and modeling, system engineering, signal integrity, materials, and commercial resources.
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
These sessions feature a discussion on specific topics by a panel of experts led by a moderator with interaction from audience members. Each session will include panelists recognized for their expertise in their respective fields. Each panelist will give a brief overview of their position on the challenges and potential solutions impacting a specific technology or application. Panel themes mirror the tracks of the technical sessions with an emphasis on Design, measurement/simulation/modeling and system engineering.
The EDI CON exhibition hall features product displays, demonstrations, design contests, speed trainings, networking opportunities, and educational talks that will bring together engineers from the Boston area and beyond to find products and tools to help them do their jobs today.
Products showcased in the exhibit hall at EDI CON USA include:
Test & Measurement, RF and microwave (including ultra-low-power, high-frequency, and space-qualified ICs and subsystems), EDA for circuit, system, and electromagnetic simulation, EMC/EMI, Signal integrity for high-speed design, simulation, and verification, Semiconductor foundry services and device manufacturing, Cable/connectors, Components and component/IDM Representatives, Materials and manufacturing
EDI CON USA Announces 2016 Gold Sponsors for Event in Boston, MA
May 16, 2016 – Norwood Massachusetts: EDI CON USA today announced the Gold Sponsors for its next event taking place September 20-22 at the Hynes Convention Center in Boston, Mass. These sponsors will be highlighted throughout the EDI CON USA 2016 conference and exhibition, which is specifically organized for engineers working on high-frequency analog and high-speed digital designs.
Raytheon Company's Tom Sikina to Keynote at EDI CON USA Plenary Session
May 12, 2016 – Norwood Massachusetts: EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, is pleased to announce Tom Sikina, Principal Engineering Fellow at Raytheon Co. as a keynote speaker in the EDI CON USA Plenary Session that will be held on Tuesday, September 20 at 4:30 PM.
EDI CON USA Announces Members of Technical Advisory Committee
May 10, 2016 – Norwood Massachusetts: EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, has announced the participants in this year’s Technical Advisory Committee.