August 4, 2016 (Norwood, Mass.) - EDI CON USA 2016 is pleased to announce that James Komiak, Ph.D., renowned amplifier expert and Global Engineering/Scientific Fellow at BAE Systems, will be kicking off the conference’s amplifier track on Tuesday September 20th at 9:30 AM with a keynote talk. Taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, the EDI CON USA conference and exhibition brings together engineers working on high-frequency analog and high-speed digital designs for learning and networking opportunities.
As a leading expert in the field of power amplifier design, Dr. Komiak is an IEEE Fellow and Distinguished Microwave Lecturer. He has 37 years of experience in system, module, and MMIC design for electronic warfare, communication, and radar applications. Currently he is a BAE Systems Global Engineering/Scientific Fellow. He has more than 100 publications and 12 patents, and received the Martin Marietta Jefferson Cup Award for "Outstanding Technical Leadership in Development and Demonstration of High Power and High Efficiency Monolithic Microwave Integrated Circuit Amplifiers and T/R Modules for Phased Array Radar." His work is represented in the MTT Symposium MMIC Historical Exhibit: "World's First Octave Band MMIC with Power Output in Excess of 10 Watts (1989)."
Komiak’s talk at EDI CON USA is called “Microwave and Millimeter Wave Power Amplifiers: Technology, Applications, Benchmarks, and Future Trends,” where he promises to address the state of the art in power amplifier device technologies, covering UHF through sub-millimeter wave frequencies. Topics will include Si LDMOS, PHEMT, InP HEMT/MHEMT and GaN HEMT.
With its Electronic Systems sector headquartered in nearby Nashua, N.H., BAE Systems is a conference sponsor for EDI CON USA 2016. In addition to keynote talks, the EDI CON technical conference will include 30-minute technical sessions, 40-minute workshops, short courses, and panels, as well as educational and training programming in the Frequency Matters Theater, demonstrations in the Signal Integrity Zone, and poster sessions on the exhibition floor.
EDI CON USA is a technical conference and exhibition that is designed for engineers and system integrators working with current technologies and methodologies to develop the electronic systems required today. Building on four successful years in China, the EDI CON event platform is launching in the USA starting in Boston, Mass. where there is a high concentration of electronic design engineers including both high-frequency and high-speed digital designers working in the commercial as well as aerospace markets. Organizers expect to attract more than 3,000 attendees during the 3-day event with close to 100 technical presentations, including workshops, short courses, and panels. The technical sessions are arranged around tracks that are focused on RF & microwave design, high-speed digital design, measurement & modeling, systems engineering, and 5G advanced communications.
The complete technical program is now available online at http://www.ediconusa.com/techprogram.asp.
Conference registration is open: http://www.ediconusa.com/registration.asp. Save 20% on a conference pass with the code MWJREADER20. Members of the press who are interested in a pass should contact Alyssa Connell.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and several major microwave related conferences/exhibitions such as the M2M and Mobile Backhaul Zones at CTIA Super Mobility. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director
Carl Sheffres, Publisher
+1 781 619 1946
+44 207 596 8787