Leading RADAR speakers bring expertise to event that covers RF/microwave and high-speed digital topics.
June 6, 2017 (Norwood, Mass.) - The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today the addition of the European Radar Summit to its conference program at the Hynes Convention Center, September 11-13 in Boston, MA.
EDI CON USA 2017 is building on its inaugural 2016 conference with multiple parallel tracks covering RF/microwave, high-speed digital and EMC/EMI topics. The conference features extended tutorials and short courses on Monday, September 11 followed by technical sessions, invited talks, workshops, panels and exhibition on Tuesday and Wednesday. Technical sessions focus on actionable, educational information for working engineers rather than product pitches and commercial presentations.
Organizers of RADAR technology sessions at the IEEE Phased Array Conference and the European Microwave Week Defense Forum have selected a number of papers to present at the EDI CON USA European Radar Summit on Tuesday, September 12. Led by Alfonso Farina, Selex ES-Italy retired, the session’s papers will cover topics such as conformal and phased array antennas, multi-static passive/active array radar, wide band signal processing and overall radar trends.
Planned papers include:
This year, EDI CON USA is the only RF/microwave industry conference and exhibition in the continental USA, and the largest high-speed technical conference on the US East Coast. Networking opportunities will abound on the exhibit floor, and attendees can enjoy a welcome reception and happy hour. More information, including registration and how to exhibit, is available at www.ediconusa.com. Attendees to the EDI CON USA European Radar Summit will require a Conference Pass.
EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas.
The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director
Carl Sheffres, Publisher
+44 207 596 8787