EDI CON USA 2017 News

EDI CON USA Announces Finalists in Outstanding Paper Awards

September 6, 2017 (Norwood, Mass.) - The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the finalists in its Outstanding Paper Awards for 2017. Papers will be presented at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, MA. The Outstanding Paper Awards ceremony will announce the winners and take place at 4:30 PM on Wednesday, September 13th in the Frequency Matters Theater on the show floor.

The Outstanding Paper Award finalists were selected from papers submitted to the conference, which will host more than 100 exhibitors and feature 88 education sessions that fall into five focused areas: RF & Microwave Design, High-Speed Digital Design, Measurement & Modeling, Systems Engineering and 5G Advanced Communications. The EDI CON USA 2017 Technical Advisory Committee evaluated the papers for quality, relevance, and educational impact. “Congratulations to all of the finalists,” said Janine Love, Event Director, “the Technical Advisory Committee members were very impressed by the strength and quality of this year’s papers.”

EDI CON USA 2017 Outstanding Paper Award Finalists:

Category: Student Paper

  • Analysis of a Simple CTLE optimization Algorithm for Lossy Channels, Ameya Ramdurgkar, University of Colorado Boulder
  • An Efficient Method for Glass Weave Skew Simulations, Ravi Chandra Bollimuntha & Dharma Paladugu, University of Colorado Boulder

Category: RADAR

  • A Family of Secondary Surveillance Radars based on Conformal Antenna Array Geometries, Leopoldo Infante, Leonardo SpA
  • Enhanced target detection and localization by cueing in multistatic passive-active radar systems, Tadeusz Brenner, Leszek Lamentowski, Roman Mularzuk, PIT- RADWAR SA
  • Innovative Algorithm for Wide Band Digital Signal Processing in modern AESA RADAR Architecture, Roberto Lalli, Caterina Rapisarda, Valerio Tocca, Alessandro Manuale, Leonardo Company S.p.A.
  • Technology Trends for Future Radar, Johannes Pieter Bezouwen & Michael Brandfass, HENSOLDT

Category: RF/MW

  • Ultrawideband DPD: The rewards and challenges of implementation in cable distribution systems, Frank Kearney & Patrick Pratt, Analog Devices
  • How are Complex Mixers, Zero IF Architectures, and Advanced Algorithms enabling the next generation of transceiver radios? Frank Kearney & David Frizelle, Analog Devices
  • Overcoming Assembly Challenges with Bottom Termination Components, Brook Sandy-Smith, Indium

Category: Power Integrity & EMI

  • Designing Power for Sensitive Circuits, Steve Sandler, Picotest
  • Transient Load Tester for Time Domain PDN Validation, Ethan Koether & Istvan Novak, Oracle Corporation
  • Shielding Effectiveness Simulation of SMT EMI Gaskets, Charlotte Blair, ANSYS & Chris Kerwien, W.L. Gore & Associates

Category: Signal Integrity

  • SI Methodology for Double-Digit Multi-Gigabit Interfaces, Ken Willis, Cadence
  • Debugging High Speed SERDES issues in multi-board interconnect systems, Syed Bokhari, Fidus Systems Inc.
  • Analyzing Low-Margin SERDES Channels, Granthana Rangaswamy, Juniper Networks
  • Addressing DDR5 design challenges with IBIS-AMI modeling techniques, Todd Westerhoff, SiSoft

EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to register for EDI CON USA 2017, is available at http://www.ediconusa.com. For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-18, 2018.

EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas. To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.

Janine Love, Event Director
Twitter: @tb_janine

Carl Sheffres, Publisher