EDI CON USA 2017 News

EDI CON USA Announces Winners in Outstanding Paper Awards

September 25, 2017 (Norwood, Mass.) - The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the winners of its Outstanding Paper Awards for EDI CON 2017. Papers were presented at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, MA.

The EDI CON USA 2017 Technical Advisory Committee evaluated the papers for quality, relevance, and educational impact. "We celebrated all of the finalists papers this year at the ceremony, with a hearty congratulations to all of the winners," said Janine Love, Event Director.

 

EDI CON USA 2017 Outstanding Paper Award WINNERS:

Category: Student Paper

  • Analysis of a Simple CTLE optimization Algorithm for Lossy Channels, Ameya Ramdurgkar, University of Colorado Boulder

Category: RADAR

  • Innovative Algorithm for Wide Band Digital Signal Processing in modern AESA RADAR Architecture, Roberto Lalli, Caterina Rapisarda, Valerio Tocca, Alessandro Manuale, Leonardo Company S.p.A.

Category: RF/MW

  • Ultrawideband DPD: The rewards and challenges of implementation in cable distribution systems, Frank Kearney & Patrick Pratt, Analog Devices

Category: Power Integrity & EMI (A Tie!)

  • Designing Power for Sensitive Circuits, Steve Sandler, Picotest
  • Transient Load Tester for Time Domain PDN Validation, Ethan Koether & Istvan Novak, Oracle Corporation

Category: Signal Integrity

  • Debugging High Speed SERDES issues in multi-board interconnect systems, Syed Bokhari, Fidus Systems Inc.

 

EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to exhibit at EDI CON USA 2018, is available at http://www.ediconusa.com. EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-19, 2018.

 

About EDI CON USA 
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.

EVENT CONTACT:
Janine Love, Event Director
+1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine

SALES CONTACT:
Carl Sheffres, Exhibition Manager
+1-781-619-1949
csheffres@mwjournal.com