EDI CON USA Introduces EDI CON University Sessions

This year, EDI CON USA will be holding its first EDI CON University sessions. These 2-hour sessions offer in-depth training in a particular topic, such as MIMO Test, Amplifier Design, and Measuring Impedance. All conference pass holders are eligible to attend, but pre-registration is required.

Earn IEEE CEUs for EDI CON University 2018 Courses



Wednesday Oct 17, 9-11AM
Antenna Design for IOT

Short time-to-market is a must for any IoT product developments to stay competitive in today’s fast evolving business environment. Playing a critical role in determining the communication range of IoT products, RF design particularly the antenna design, becomes crucial to the success of the introduction of new IoT products. Competence in advanced antenna designs can definitely strengthen the competitive edge of IoT product design or manufacturing companies.

This course offers participants technical insights on the vital aspects of antenna design from an industrial and practical perspective. It covers fundamental theory, concepts & definitions to the features, specifications and performance of different types of commonly-used and advanced antennas found in IoT products. Practical implementation strategies on overall product design for optimum antenna performance will also be presented.

Who Should Attend:
Antenna designers, RF designers, IoT product designers, field application engineers, design managers, business development managers and related professionals.

Henry Lau received his M.Sc. and MBA degrees from UK and USA respectively. He has more than 27 years of experience in designing RF systems, products and RFICs in both Hong Kong and US. He worked for Motorola and Conexant in US as Principal Engineer on developing RFICs for cellular phone and silicon tuner applications. Mr Lau holds five issued patents and has two pending all in RF designs. He is currently running Lexiwave Technology, a wireless and IOT solutions company in Hong Kong and US designing and selling RFICs, RF modules, RF and Radar solutions. He has also been teaching numerous RF-related courses internationally. He has chaired two symposiums and three seminars in wireless and IoT technologies in Hong Kong during 2016 and 2017.


Wednesday Oct 17, 9-11AM
Millimeter Wave Measurement Insights

Sponsored by Keysight Technologies

Consisting of two presentations, this university session covers both millimeter wave measurement challenges and specific techniques for component characterization. In order to address wide bandwidth requirements of next generation wireless and radar systems, researchers are exploring millimeter-wave bands. Compared to traditional bandwidths used at sub 6 GHz for cellular communications, the use of hundreds or even several GHz of spectrum at these higher frequencies requires new components with much higher physical tolerances to achieve the desired performance. The techniques used to measure the RF performance of these new devices require special consideration. The first presentation will cover the basics of making measurements at millimeter-wave frequencies as it relates to transmission line theory, connector topology, and over-the-air transmission and will also examine a number of associated design and measurement challenges at these wider bandwidths. With an increased need to utilize the millimeter-wave frequency band, there are even more demands on designers and manufacturers in the industry to fully characterize and test both active and passive components at these frequencies. This second presentation will focus on how a vector network analyzer can be utilized to address the need for millimeter-wave component characterization for both passive and active devices and will include real-life measurement examples.

Gennady Farber has been with Agilent-Keysight since 2005 and brings a wealth of experience. Prior to that, he received his MS in Radio Physics from Leningrad Polytechnic University, USSR. After moving to the USA in 1992, Gennady worked at companies such as Varian and Intel. As a Keysight Applications Engineer, Gennady brings extensive experience in developing and analyzing RF /uWave communication systems with a focus on extra wideband V-Band and E-Band.


Suren Singh received his BSEE from University of Durban-Westville, Durban South Africa in 1985. He completed a Graduate Diploma at the University of Witwatersrand, Johannesburg South Africa in December 1992. He then went on to complete his MSEE at the University of Witwatersrand, Johannesburg in 1995. Suren has been with the Hewlett-Packard Company, Agilent Technologies and now Keysight Technologies since 1986. His experience at Keysight includes application engineering, product design, manufacturing and test process development for microwave hybrid microcircuits. He currently holds the position of industry application specialist focused on millimeter wave measurement solutions and applications. Currently an IEEE member and presented several papers at IEEE conference on materials and 5G testing. In addition, he is responsible for the metrology products for performance network analyzers, including both calibration and verification.


Wednesday Oct 17, 9-11AM
How to Measure Ultra-Low Impedance (100uOhm and lower) PDNs

Measuring ultra-low impedance is a common requirement for assuring power integrity. This meant measuring 1 milliOhm to 2 milliOhm voltage regulator modules (VRM’s) and power distribution networks or (PDN’s). Every year we talked about how operating voltages are falling and frequency is increasing. Maybe some of us realized this meant higher operating current and therefore lower impedance.

Today, it is common to see 500uOhm power rails, but more recently the bleeding edge is below 100uOhms. Measuring 100uOhms is a significant challenge, even using the venerable 2-port shunt-thru measurement that has served as the staple of ultra-low impedance measurement. The dynamic range of the 100uOhm, 2-port, measurement is 108dB. An impedance dip to 30uOhms reduces this to 118dB. This dynamic range presses the limits of the noise floor for even the best VNA. The addition of operating voltage noise, including ripple and load-induced transients increases the challenge.

At these ultra-low impedance levels everything matters, from the quality of the instrument interconnects, to the quality of the ground loop isolator. In this tutorial, you’ll learn some techniques that will improve the accuracy and fidelity of your sub 100uOhm measurements. You’ll learn the pros and cons of the 2-port vs 3-port measurement technique. With a little bit of luck, we’ll demonstrate a 100uOhm impedance measurement as well as showing some measurements highlight the challenges you’ll face along the way.

Key Takeaways:

  • Ultra-low impedance measurement basics
  • Choosing between 2-port and 3-port measurement techniques
  • Dealing with measurement ground loops
  • The importance of interconnects and signal to noise ratio
  • Self-impedance vs Transfer impedance
  • Measuring something you know (close to 100uOhms)

Steve Sandler has been involved with power system engineering for nearly 40 years. The founder and CEO of Picotest.com, a company specializing in instruments and accessories for high-performance power system and distributed system testing, Steve is also the founder of AEi Systems, a company that specializes in worst-case circuit analysis for high-reliability industries.

He frequently lectures and publishes internationally on the topics of power integrity and distributed power system design. His most recent books include: Switched-Mode Power Supply Simulation with SPICE (2018) and Power Integrity: Measuring, Optimizing and Troubleshooting Power-Related Parameters in Electronics Systems (2014). Steve is a winner of the Jim Williams ACE Award for Contributor of the Year (2015) and the recipient of both the DesignCon 2017 and EDICON USA 2017 Best Paper Awards.


Thursday Oct 18, 9-11AM
Real Time Spectral Analysis of Power Rail Noise

Sponsored by Teledyne LeCroy

While the real world is the time domain, sometimes we can gain insight about the origin of problems by looking in the frequency domain. The time domain and frequency domain properties of power rail noise is a little different than for digital signals. For some types of products, such as analog parts, mixed signal or clock generation, very low levels of power rail noise can have a big impact on performance. Sometimes the best way of finding these noise sources is by frequency domain analysis. In this seminar, we introduce the best measurement practices for analyzing the real time spectra of signals and apply these methods to power rail noise to provide insight into the root cause of the problems.

Eric Bogatin is currently a Signal Integrity Evangelist with Teledyne LeCroy and the Dean of the Signal Integrity Academy, at www.beTheSignal.com. Additionally, he is an Adjunct Professor at the University of Colorado - Boulder in the ECEE dept and editor of the Signal Integrity Journal.

Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering an management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices. He has written six technical books in the field and presented classes and lectures on signal integrity worldwide.


Thursday Oct 18, 9-11AM
High-Speed Board Design Rules to Get Your PCB Designed Right the First Time

Understanding the principles of signal/power integrity and EMI by the electronic engineer is necessary, but, unfortunately, our experience does not guarantee the successful functioning of the system. Converting the principles into quantities built by the PCB layout designer will bring us closer to this goal. This lecture will cover 10 critical issues regarding the return current path and bypass capacitors roles, crosstalk by coupling, gap crossing, layers construction and order, stitching vias, and Faraday cages. All of these topics are converted into a guide that is concise but effective and proven to achieve the goals.

Shalom-Shlomi Zigdon is an international lecturer for high-speed board design for signal integrity and EMC for R&D teams. He is an EDI CON TAC member in the USA and a Chairman of the IEEE EMC & SI/PI Symposium at Israel 2014-2018. Since 1995, he has been the CEO & owner of The College for Board Design and PCB Engineering at Israel [www.itech-icollege.com]. He is a committee member of the following IPC standards committees: IPC-2251 High Speed Board Design; IPC-2221 PCB Design; IPC-2226 HDI [High Density Interconnection] PCB Design. Formerly, he served as CEO and VP of Medical Simulator, a hardware engineer at IAI [Israel Aircraft Industries], and a technologist for PCB & MCM at Elbit System.


Thursday Oct 18, 9-11AM
Build Your Own VNA

Sponsored by Mini Circuits

This hands-on course is designed for university students, graduate students, engineers who are early in their career, or anyone who wants a better understanding of how measurements actually work and what effect a good measurement has on your design. The goal of this course is to bridge the gap between academics and real-world engineering.

Attendees will work in teams to build a VNA, load the scripts, talk about the math behind the measurements, make a measurement, and see if they got the measurement correct. Topics covered include: transmission line theory and lab measurements, basics of s-parameter measurements, and construction of a VNA.

The VNA Kit includes all the hardware (provided by Mini Circuits) and software (provided by Vayyar Imaging) to generate the VNA transmitter signals and capture/receive signals (reference and reflected) to implement a full vector measurement function and generate a complete set of microwave network analysis.

Aaron Vaisman is LTCC product line manager at Mini-Circuits. He holds a B.Sc. degree from Universidad de los Andes, Colombia and M.Sc. from Columbia University. He has been with Mini-Circuits since 2010 holding several different positions as junior design engineer, RF design engineer, LTCC principal design engineer, LTCC product line engineer and more recently, LTCC product line manager. Within the company, Mr. Vaisman has been mainly involved in the design of mixers, frequency multipliers, limiters, filters, baluns, LNAs, couplers power splitters, planar to waveguide transitions and packages. His primary area of interest and research is on wireless communication circuits, network analysis and synthesis techniques, EM simulation techniques, measurement uncertainty and statistical analysis. His design experience ranges from HF to V frequency bands. He has been awarded three patents on some of the above mentioned fields and some others are pending for approval.

Aleksey Amitai, is a Project Manager at Vayyar Imaging, an Israel based company that creates radar-on-chip systems for imaging, monitoring and sensing applications. In his current role Aleksey leads projects in the test and measurement equipment business unit.With over 20 years of experience in RF and RFIC, Aleksey designed and led RF verification, and was in charge of transitioning RF ASICs to mass production. Prior to joining Vayyar Imaging, Aleksey served in various positions within Intel’s Mobile Wireless Group. He managed RFIC validation teams and was in charge of WiFi RF core development in complex, wireless multicore single chip targeted for the cellular market. Aleksey holds a B.SC from Holon’s Institute of Technology.